System-in-package cleaning: POP stacked chips/ System-in-package are welded at a mm level spacing, leaving behind hygroscopic substances such as active agents after the application of soldering flux. If there is a small amount of hygroscopic active agent in the smaller layer spacing, it can occupy a relatively large chip space, affecting the reliability of the chip. To remove residues from a limited space, cleaning agents need to have low surface tension to penetrate into the interlayer chips, achieving the goal of removing residues. The cleaning agent developed by Unibright has excellent infiltration ability to ensure the complete removal of residual active agents between chips.

Unibright provides you with a full process solution for SIP system level packaging water-based cleaning.